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TLV2781IDR - Texas Instruments

Description: Single 1.8V RRIO, 8MHz Amplifier

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TLV2781IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV2781IDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV2781IDR Details

  • Manufacturer Part Number:

    TLV2781IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.89 V/us

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.77 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2781IDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the GND pins, and placing the device close to the power supply bypass capacitors to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • The TLV2781IDR has a built-in thermal shutdown feature that disables the device when the junction temperature exceeds 150°C. To handle this, ensure good thermal design and heat dissipation, and consider adding thermal monitoring and shutdown circuitry to prevent damage.
  • While the datasheet specifies a minimum input voltage of 2.7V, it's recommended to operate the device with a minimum input voltage of 3V to ensure stable operation and to account for voltage drops in the system.
  • Use a low-pass filter with a cutoff frequency below the switching frequency (typically 1-2 MHz) to filter out noise and ripple. A simple RC filter with a 10uF capacitor and a 10Ω resistor can be effective.
  • While the TLV2781IDR is rated for operation up to 125°C, it's essential to consider the device's thermal design and heat dissipation in high-temperature environments. Ensure good thermal design, and consider derating the device's output current and voltage to prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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