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TLV2782CDGK - Texas Instruments

Description: Op Amp Dual High Speed Amplifier R-R I/O ±1.8V/3.6V 8-Pin VSSOP Tube

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TLV2782CDGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2782CDGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV2782CDGK Details

  • Manufacturer Part Number:

    TLV2782CDGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1.89 V/us

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.54 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2782CDGK Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the TLV2782CDGK placed close to the power supply pins, and the input and output capacitors placed as close as possible to the device. A star-ground configuration is also recommended to minimize noise and EMI.
  • The TLV2782CDGK has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane or a heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
  • The TLV2782CDGK has an absolute maximum input voltage rating of 7V, but it's recommended to operate the device within the recommended input voltage range of 2.7V to 5.5V to ensure reliable operation and minimize the risk of damage.
  • The TLV2782CDGK is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's output current and voltage at high temperatures to ensure reliable operation.
  • Oscillations or instability issues with the TLV2782CDGK can be caused by a variety of factors, including poor layout, inadequate decoupling, or incorrect component selection. To troubleshoot these issues, check the layout and decoupling, ensure that the input and output capacitors meet the recommended specifications, and verify that the device is operated within its recommended operating conditions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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