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TLV3012AIDBVR - Texas Instruments

Description: Nanopower, 1.8V, SOT23 Push-Pull Comparator with Voltage Reference

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PCB Footprints
TLV3012AIDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
TLV3012AIDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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TLV3012AIDBVR Details

  • Manufacturer Part Number:

    TLV3012AIDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    12000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TLV3012AIDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV3012AIDBVR involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, make sure to follow the recommended PCB layout, use a sufficient decoupling capacitor (at least 1uF) close to the device, and keep the input and output impedance matched. Also, avoid using long input traces and keep the device away from noise sources.
  • The maximum power dissipation of the TLV3012AIDBVR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the operating temperature and thermal resistance.
  • The TLV3012AIDBVR is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper thermal management to prevent overheating.
  • To troubleshoot issues with the TLV3012AIDBVR, start by checking the power supply voltage, input and output signals, and decoupling capacitors. Use an oscilloscope to check for oscillations, noise, or distortion. Also, verify that the device is properly soldered and the PCB layout is correct. If the issue persists, consult the datasheet and application notes for guidance.

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TLV3012AIDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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