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TLV313IDCKT - Texas Instruments

Description: Low-Power, RRIO, 750-uV Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems

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PCB Footprints
TLV313IDCKT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK
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TLV313IDCKT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK
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TLV313IDCKT Details

  • Manufacturer Part Number:

    TLV313IDCKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-06-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.25 mm

TLV313IDCKT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV313IDCKT is 670mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance from junction to ambient (125°C/W).
  • Yes, the TLV313IDCKT is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum power dissipation should be considered.
  • To minimize noise and ensure stability, follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, consider using a low-ESR capacitor for power supply decoupling and a ferrite bead or inductor for noise filtering.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 1μF. However, the optimal capacitance values may vary depending on the specific application and frequency of operation.
  • While the TLV313IDCKT is an op-amp, it can be used as a comparator in some applications. However, it's essential to consider the device's bandwidth, slew rate, and input offset voltage when designing a comparator circuit. Additionally, the TLV313IDCKT may not have the same level of hysteresis or noise immunity as a dedicated comparator.

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TLV313IDCKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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