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TLV320AIC1107PWR - Texas Instruments

Description: Interface - CODECs Prog. PCM CODEC

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TLV320AIC1107PWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW(R-PDSO-G20) HEIGHT 1.2
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TLV320AIC1107PWR - Texas Instruments  - 3D model - Small Outline Packages - PW(R-PDSO-G20) HEIGHT 1.2
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TLV320AIC1107PWR Details

  • Manufacturer Part Number:

    TLV320AIC1107PWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Companding Law:

    A-LAW

  • Filter:

    YES

  • Input Code:

    TWOS COMPLEMENT

  • Input Type:

    SINGLE-ENDED/DIFF

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Linear Coding:

    13-BIT

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    VOLTAGE

  • Output Code:

    TWOS COMPLEMENT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.007 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    PCM CODEC

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TLV320AIC1107PWR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VDDA, and then the digital interface signals (e.g., I2C, SPI, etc.). This ensures that the analog and digital sections of the device are properly initialized.
  • The TLV320AIC1107PWR is a highly configurable device. To configure it for a specific audio application, refer to the device's programming guide and use the provided software development kit (SDK) to generate the necessary register settings. You can also consult the device's datasheet and application notes for guidance on configuring the device for specific use cases.
  • The maximum input signal level that the TLV320AIC1107PWR can handle depends on the specific configuration and the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) being used. In general, the device can handle input signal levels up to 2.5 Vrms for the ADC and up to 1.5 Vrms for the DAC. However, it's recommended to consult the device's datasheet and application notes for specific guidance on input signal levels.
  • To optimize the TLV320AIC1107PWR for low power consumption, use the device's power-down modes, adjust the clock frequency, and optimize the digital interface configuration. Additionally, consider using the device's built-in power-saving features, such as the automatic power-down mode, and optimize the system's power management strategy to minimize power consumption.
  • The recommended layout and routing for the TLV320AIC1107PWR involves separating the analog and digital sections of the device, using a solid ground plane, and minimizing noise coupling between the analog and digital signals. Consult the device's datasheet and application notes for specific guidance on layout and routing, and consider using a 4-layer or 6-layer PCB to minimize noise and ensure optimal performance.

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TLV320AIC1107PWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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