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TLV342ID - Texas Instruments

Description: Operational Amplifiers - Op Amps Low-Voltage R-To-R Output CMOS

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TLV342ID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV342ID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV342ID Details

  • Manufacturer Part Number:

    TLV342ID

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.003 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2200

  • Voltage Gain-Min:

    562.34

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV342ID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV342ID is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the SOT23 package, it is 300mW at 25°C. Refer to the thermal characteristics section of the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF between the output and the inverting input. This helps to compensate for the op-amp's internal capacitance and ensures stability.
  • To minimize noise and EMI, follow good PCB layout practices such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp's power pins. Also, avoid running high-frequency signals near the op-amp's inputs and outputs.
  • While the TLV342ID can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current drive capability. Texas Instruments recommends using a dedicated comparator device, such as the TLV703, for comparator applications.
  • The TLV342ID has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected package when not in use.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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