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TLV3494AID - Texas Instruments

Description: Texas Instruments TLV3494AID Quad Comparator, Push-Pull O/P, 6μs 3 V, 5 V 14-Pin SOIC

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TLV3494AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLV3494AID - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLV3494AID Details

  • Manufacturer Part Number:

    TLV3494AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    15000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.0048 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV3494AID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV3494AID is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 670mW at 25°C. For the SOT23 package, it is 300mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to add a capacitor (typically 10nF to 100nF) between the output and the inverting input pins. This capacitor helps to compensate for the op-amp's internal capacitance and ensures stability.
  • To minimize noise and EMI, it is recommended to follow good PCB layout practices, such as keeping the input and output traces short and separate, using a solid ground plane, and avoiding routing signals near the op-amp's power pins. Additionally, use a decoupling capacitor (typically 0.1uF to 1uF) between the power supply pins and the ground plane to filter out noise.
  • While the TLV3494AID can be used as a comparator, it is not recommended due to its op-amp architecture. The TLV3494AID is designed for linear amplification, and its output stage is not optimized for high-speed switching. For comparator applications, it is recommended to use a dedicated comparator IC, such as the TLV7031 or TLV7041.
  • The input impedance of the TLV3494AID is dependent on the frequency and the input common-mode voltage. At low frequencies, the input impedance is typically around 10MΩ. At high frequencies, the input impedance decreases due to the op-amp's internal capacitance. Refer to the datasheet's input impedance vs. frequency graph for more information.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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