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TLV3501AID - Texas Instruments

Description: 4.5ns Rail-to-Rail, High Speed Comparator in Microsized Packages

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TLV3501AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV3501AID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV3501AID Details

  • Manufacturer Part Number:

    TLV3501AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    7.5 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV3501AID Frequently Asked Questions (FAQs)

  • The TLV3501AID is a high-frequency device, so it's essential to follow good high-frequency PCB design practices. Keep the input and output traces short and away from noise sources. Place the device close to the power supply and use a solid ground plane to reduce noise and radiation.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low equivalent series resistance (ESR). Additionally, add a 10nF to 100nF capacitor between the VIN and GND pins to filter out high-frequency noise.
  • The TLV3501AID can handle input voltages up to 15V, but it's recommended to keep the input voltage below 12V to ensure reliable operation and to prevent overheating.
  • The output voltage of the TLV3501AID can be calculated using the formula: VOUT = (R1 / R2) * (VIN - VREF), where R1 and R2 are the resistors in the feedback network, VIN is the input voltage, and VREF is the internal reference voltage (1.24V).
  • The TLV3501AID can deliver up to 50mA of output current, but it's recommended to keep the output current below 30mA to ensure reliable operation and to prevent overheating.

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TLV3501AID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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