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TLV3501AZQDBVRQ1 - Texas Instruments

Description: Automotive Catalog 4.5ns Rail-to-Rail, High Speed Comparator in Microsized Packages

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PCB Footprints
TLV3501AZQDBVRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-23 (6)
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TLV3501AZQDBVRQ1 - Texas Instruments  - 3D model - SOT23 (6-Pin) - SOT-23 (6)
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TLV3501AZQDBVRQ1 Details

  • Manufacturer Part Number:

    TLV3501AZQDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    7.5 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TLV3501AZQDBVRQ1 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV3501AZQDBVRQ1 involves placing the device close to the power supply, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it is recommended to place a 0.1uF decoupling capacitor between the VIN pin and the GND pin.
  • To ensure the TLV3501AZQDBVRQ1 is stable and does not oscillate, it is recommended to follow the recommended layout and placement guidelines, use a stable input voltage, and ensure that the output capacitor is properly sized and placed close to the device. Additionally, it is recommended to add a small resistor (e.g. 10 ohms) in series with the output capacitor to prevent oscillation.
  • The maximum input voltage that the TLV3501AZQDBVRQ1 can handle is 5.5V. Exceeding this voltage may cause damage to the device.
  • The TLV3501AZQDBVRQ1 is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It is recommended to consult the datasheet and application notes for more information on using the device in high-temperature environments.
  • To troubleshoot issues with the TLV3501AZQDBVRQ1, it is recommended to check the input voltage, output voltage, and output current. Verify that the device is properly powered, and that the input and output capacitors are properly sized and placed. Additionally, check for any signs of overheating, and ensure that the device is not exposed to excessive noise or EMI.

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TLV3501AZQDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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