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TLV3502AID - Texas Instruments

Description: TLV3502AID Texas Instruments, Dual Comparator, Push-Pull O/P, 3 V, 5 V 8-Pin SOIC

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TLV3502AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV3502AID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV3502AID Details

  • Manufacturer Part Number:

    TLV3502AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    7.5 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV3502AID Frequently Asked Questions (FAQs)

  • The TLV3502AID is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure proper operation. Place the device close to the power supply, use short traces, and avoid vias under the device. Also, ensure that the input and output traces are well-separated to minimize crosstalk.
  • The TLV3502AID has a specific power-up sequence requirement. Apply the power supply voltage (VCC) before the input signal, and ensure that the input signal is not applied until VCC is stable. This sequence helps prevent latch-up and ensures proper device operation.
  • The TLV3502AID can drive capacitive loads up to 100 pF. However, it's essential to consider the frequency of operation and the impedance of the load when determining the maximum capacitive load. Exceeding the recommended capacitive load may affect the device's stability and performance.
  • To filter out noise and ripple on the power supply line, use a low-ESR capacitor (e.g., 10 μF) in parallel with a high-frequency capacitor (e.g., 100 nF) as close to the device as possible. This helps to decouple the power supply and reduce noise coupling into the device.
  • The TLV3502AID is specified to operate over a temperature range of -40°C to 125°C. However, it's essential to consider the device's thermal characteristics and ensure that the junction temperature (TJ) does not exceed 150°C to maintain reliability and performance.

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TLV3502AID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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