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TLV3602QDGKRQ1 - Texas Instruments

Description: Analog Comparators Automotive, 2.5-ns, dual-channel high-speed rail-to-rail comparator with push-pull outputs 8-VSSOP -40 to 125

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TLV3602QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK-1
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TLV3602QDGKRQ1 Details

  • Manufacturer Part Number:

    TLV3602QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    5 µA

  • Bias Current-Max (IIB) @25C:

    5 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    2.5 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    7 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV3602QDGKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV3602QDGKRQ1 datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability and prevent oscillations, it's crucial to follow the recommended compensation network and component values provided in the datasheet. Additionally, make sure to use a low-ESR output capacitor, and consider adding a small ceramic capacitor (e.g., 10nF) in parallel with the output capacitor to improve stability.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device. Exceeding the maximum input voltage can lead to reduced performance, increased power consumption, or even device failure.
  • The TLV3602QDGKRQ1 is rated for operation up to 125°C (TJ), but it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat efficiently.
  • The output capacitor value and type depend on the specific application requirements. As a general guideline, use a low-ESR output capacitor with a value between 10uF and 22uF. For high-current applications, consider using a larger output capacitor value. Additionally, choose a capacitor with a voltage rating that exceeds the output voltage of the device.

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TLV3602QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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