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TLV3701QDBVRG4Q1 - Texas Instruments

Description: Automotive Single Nanopower Push-Pull Comparator

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PCB Footprints
TLV3701QDBVRG4Q1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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TLV3701QDBVRG4Q1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV3701QDBVRG4Q1 Details

  • Manufacturer Part Number:

    TLV3701QDBVRG4Q1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    240000 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.0008 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TLV3701QDBVRG4Q1 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV3701QDBVRG4Q1 involves keeping the input and output pins as close as possible to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it is recommended to place a 0.1uF decoupling capacitor between the VCC and GND pins as close to the device as possible.
  • To ensure the TLV3701QDBVRG4Q1 is operating within its recommended operating conditions, verify that the input voltage is within the recommended range of 1.8V to 5.5V, the ambient temperature is within the range of -40°C to 125°C, and the device is not exposed to excessive noise or electromagnetic interference.
  • The TLV3701QDBVRG4Q1 can sink or source up to 10mA of output current. However, it is recommended to limit the output current to 5mA or less to ensure reliable operation and to prevent overheating.
  • To troubleshoot issues with the TLV3701QDBVRG4Q1, start by verifying the input voltage and ensuring it is within the recommended range. Check for any signs of physical damage or overheating. Use an oscilloscope to verify the output signal and check for any signs of noise or distortion. If the issue persists, consult the datasheet and application notes for further guidance.
  • Yes, the TLV3701QDBVRG4Q1 is suitable for use in high-reliability applications. It is manufactured using a high-reliability process and is designed to meet the requirements of automotive and industrial applications. However, it is recommended to consult the datasheet and application notes for specific guidance on using the device in high-reliability applications.

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TLV3701QDBVRG4Q1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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