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TLV5604CDR - Texas Instruments

Description: IC DAC 10BIT V-OUT 16SOIC

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TLV5604CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TLV5604CDR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TLV5604CDR Details

  • Manufacturer Part Number:

    TLV5604CDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    18 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5604CDR Frequently Asked Questions (FAQs)

  • The TLV5604CDR is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure proper operation. Place the device close to the power supply, use short traces, and avoid crossing signal lines over the power planes. Also, ensure that the input and output capacitors are placed close to the device.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 1-10uF. The output capacitor (COUT) should be a low-ESR ceramic or tantalum capacitor with a value between 10-22uF. The capacitor values and types may vary depending on the specific application and output voltage requirements.
  • The TLV5604CDR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure reliable operation and minimize the risk of damage.
  • The TLV5604CDR operates within a temperature range of -40°C to 125°C. Ensure good airflow around the device, and avoid operating it in high-temperature environments or near heat sources. Also, consider using a heat sink or thermal pad to dissipate heat if the device is expected to operate at high temperatures.
  • The TLV5604CDR can output voltages between 0.9V to 5.5V. However, it's recommended to keep the output voltage between 1.2V to 3.3V for optimal performance and efficiency.

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TLV5604CDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV5604CDRG4 Texas Instruments

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