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TLV5608IDW - Texas Instruments

Description: TLV5608IDW, 10 bit-Bit DAC 8-channel 283ksps, SPI, Microwire, 20-Pin SOIC

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TLV5608IDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW
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TLV5608IDW Details

  • Manufacturer Part Number:

    TLV5608IDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Linearity Error-Max (EL):

    0.195%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.283 MHz

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    21 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV5608IDW Frequently Asked Questions (FAQs)

  • The TLV5608IDW is a sensitive analog device, and proper layout and placement are crucial for optimal performance. It is recommended to place the device close to the analog signal sources, use a solid ground plane, and keep the analog and digital traces separate. Additionally, it is recommended to use a 4-layer PCB with a dedicated analog ground plane.
  • The TLV5608IDW has a specific power-up sequence requirement. It is recommended to power up the device in the following order: AVDD, DVDD, and then the analog input signals. This ensures that the internal biasing and reference circuits are properly initialized.
  • The TLV5608IDW requires proper decoupling to ensure stable operation. It is recommended to use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the AVDD and DVDD pins.
  • To optimize the performance of the TLV5608IDW in noisy environments, it is recommended to use a low-pass filter on the analog input signals, use a shielded enclosure, and keep the device away from high-frequency noise sources. Additionally, using a ferrite bead or a common-mode choke on the power supply lines can help to reduce noise coupling.
  • The TLV5608IDW is specified to operate over a temperature range of -40°C to 125°C. However, it is recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.

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TLV5608IDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV5608IDWRG4 Texas Instruments

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