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TLV5613IDW - Texas Instruments

Description: 12-Bit, DAC, Parallel, Voltage Out, Pgrmable Settling Time/Pwr Consump., PwrDn

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TLV5613IDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G20)
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TLV5613IDW - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G20)
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TLV5613IDW Details

  • Manufacturer Part Number:

    TLV5613IDW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    4.6 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.286 MHz

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TLV5613IDW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in the TLV5613IDW datasheet, but it's essential to follow general high-frequency PCB design principles, such as minimizing trace lengths, avoiding vias, and using a solid ground plane.
  • The TLV5613IDW has a rail-to-rail output swing, but it's crucial to ensure the output voltage doesn't exceed the supply rails. Additionally, the output current capability is limited to 30mA, so it's essential to impedance match the output stage to prevent current limiting and ensure signal integrity.
  • A simple RC filter or a more complex active filter can be used to reduce noise and ripple. The filter design depends on the specific requirements, but a general rule of thumb is to use a filter with a cutoff frequency at least 10 times higher than the desired signal bandwidth.
  • The TLV5613IDW is specified to operate from -40°C to 125°C. Ensure proper thermal management by providing adequate heat dissipation, using thermal pads or heat sinks if necessary, and avoiding hot spots on the PCB.
  • The TLV5613IDW requires a single supply voltage between 2.7V and 5.5V. Ensure the power supply is clean and well-regulated, and consider using a low-dropout regulator (LDO) or a switching regulator with a low noise output to minimize power supply noise and ripple.

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TLV5613IDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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