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TLV5617ACD - Texas Instruments

Description: Texas Instruments TLV5617ACD, 2-channel 10 bit Serial DAC, 93ksps, 8-Pin SOIC

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TLV5617ACD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A height 1.75
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TLV5617ACD - Texas Instruments  - 3D model - Small Outline Packages - D0008A height 1.75
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TLV5617ACD Details

  • Manufacturer Part Number:

    TLV5617ACD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.093 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    2.5 µs

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5617ACD Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the device placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving. The device should be placed on a solid ground plane, and the input and output traces should be kept short and away from noise sources.
  • The TLV5617ACD has a specific power-up and power-down sequencing requirement. The VCC pin should be powered up before the VIN pin, and the VIN pin should be powered down before the VCC pin. This ensures that the internal voltage regulator is properly enabled and disabled.
  • The TLV5617ACD can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillations or instability in the output voltage.
  • A simple RC filter can be used to filter the output voltage of the TLV5617ACD. A 1 kΩ resistor and a 10 nF capacitor can be used to filter out high-frequency noise. However, the filter values may need to be adjusted based on the specific application requirements.
  • The TLV5617ACD has a thermal derating of 13.9 mW/°C above 25°C. This means that the device's power dissipation should be reduced as the ambient temperature increases to prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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