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TLV5618AMJGB - Texas Instruments

Description: DAC 2-CH Resistor-String 12-bit 8-Pin CDIP Tube

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TLV5618AMJGB - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - JG (R-GDIP-T8)
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TLV5618AMJGB - Texas Instruments  - 3D model - Dual-In-Line Packages - JG (R-GDIP-T8)
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TLV5618AMJGB Details

  • Manufacturer Part Number:

    TLV5618AMJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.9 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.093 MHz

  • Screening Level:

    38535Q/M;38534H;883B

  • Seated Height-Max:

    5.08 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

TLV5618AMJGB Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV5618AMJGB involves placing the device close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is driving, and using a ground plane to minimize noise and electromagnetic interference (EMI).
  • To ensure the TLV5618AMJGB is properly decoupled, use a 0.1 μF ceramic capacitor between the VCC pin and the GND pin, and a 10 μF capacitor between the VCC pin and the GND pin. Place the capacitors as close to the device as possible.
  • The maximum clock frequency for the TLV5618AMJGB is 50 MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal.
  • The TLV5618AMJGB has a built-in POR and BOR function. The POR function resets the device when the power supply voltage (VCC) rises above 1.5 V, and the BOR function resets the device when the VCC falls below 1.4 V. No external components are required to handle these functions.
  • The thermal impedance of the TLV5618AMJGB is typically 30°C/W (junction-to-ambient) and 10°C/W (junction-to-case). This information is useful for thermal management and heat sink design.

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TLV5618AMJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TLV5618AMJG Texas Instruments

D/A Converter, 1 Func, Serial Input Loading, 3us Settling Time, CDIP8