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TLV5623CDR - Texas Instruments

Description: 8-Bit, 3 us DAC, Serial Input, Pgrmable Settling Time/ Power Consumption, Ultra Low Power

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TLV5623CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV5623CDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV5623CDR Details

  • Manufacturer Part Number:

    TLV5623CDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.4 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5623CDR Frequently Asked Questions (FAQs)

  • The TLV5623CDR is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. Additionally, decoupling capacitors should be placed as close to the device as possible.
  • The internal voltage regulator of the TLV5623CDR requires a 1-μF ceramic capacitor (X5R or X7R type) connected between the VREG pin and GND. This capacitor helps to stabilize the internal voltage regulator and ensure proper operation.
  • To ensure proper operation, TI recommends powering up the TLV5623CDR in the following sequence: 1) Apply VCC, 2) Apply AVCC, and 3) Apply the input signal. This sequence helps to prevent latch-up and ensures that the device powers up correctly.
  • To optimize the TLV5623CDR's performance, consider the following: 1) Choose the correct output voltage range for your application, 2) Select the appropriate gain setting, 3) Optimize the input impedance, and 4) Use proper filtering and decoupling techniques. Additionally, consult the datasheet and application notes for specific guidance on optimizing performance.
  • The TLV5623CDR is a high-power device, and thermal considerations are essential to ensure reliable operation. Ensure good airflow, use a heat sink if necessary, and follow TI's thermal design guidelines to prevent overheating and thermal shutdown.

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TLV5623CDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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