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TLV5623IDGK - Texas Instruments

Description: 8-Bit, 3 us DAC, Serial Input, Pgrmable Settling Time/ Power Consumption, Ultra Low Power

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TLV5623IDGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5623IDGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV5623IDGK Details

  • Manufacturer Part Number:

    TLV5623IDGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.4 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.102 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    20 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV5623IDGK Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the TLV5623IDGK involves keeping the analog and digital grounds separate, using a star-ground configuration, and minimizing the length of the analog input traces to reduce noise and interference.
  • To ensure accurate voltage reference output, ensure that the input voltage is within the recommended range, the device is properly decoupled, and the output is not loaded excessively. Also, consider using a low-pass filter to reduce noise and ripple.
  • The TLV5623IDGK can drive a maximum capacitive load of 100nF. Exceeding this limit may cause instability or oscillations in the output voltage.
  • The POR and BOR features of the TLV5623IDGK can be handled by ensuring that the power supply voltage is stable and within the recommended range, and by using external circuitry to debounce the reset signal if necessary.
  • The thermal impedance of the TLV5623IDGK package is typically around 120°C/W. This value can be used to estimate the junction temperature of the device under different operating conditions.

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TLV5623IDGK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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