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TLV5626CD - Texas Instruments

Description: 8-Bit, 1 us Dual DAC, Serial Input, Pgrmable Int. Ref., Settling Time

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TLV5626CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)_1
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TLV5626CD - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)_1
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TLV5626CD Details

  • Manufacturer Part Number:

    TLV5626CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.6 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.3906%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.278 MHz

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Max:

    5.5 µs

  • Settling Time-Nom (tstl):

    0.8 µs

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TLV5626CD Frequently Asked Questions (FAQs)

  • The TLV5626CD is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using a solid ground plane, and keeping the input and output traces short and separate.
  • The TLV5626CD can dissipate up to 1.4W of power, so it's crucial to ensure proper thermal management. TI recommends using a thermal pad or heat sink, and ensuring good airflow around the device. The junction-to-ambient thermal resistance (RθJA) is 45°C/W.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 100nF. However, the optimal capacitance values may vary depending on the specific application and operating conditions.
  • The TLV5626CD requires a bias voltage (VCC) of 2.7V to 5.5V, and the recommended bias current is 10mA to 20mA. Ensure that the input voltage (VIN) is within the recommended range (0.5V to VCC-1.5V), and that the output voltage (VOUT) is within the recommended range (0.5V to VCC-1.5V).
  • The TLV5626CD can operate at clock frequencies up to 50MHz, but the recommended frequency range is 10kHz to 1MHz. The recommended duty cycle is 50%, but the device can operate with a duty cycle as low as 10% or as high as 90%.

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TLV5626CD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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