SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Regulator Type:
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Seated Height-Max:
1.1 mm
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Voltage Tolerance-Max:
1%
Width:
3 mm
TLV76733DGNR Frequently Asked Questions (FAQs)
A good PCB layout for the TLV76733DGNR involves keeping the input and output traces separate, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The output capacitor should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 1uF to 10uF, with a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are good options.
The TLV76733DGNR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure optimal performance and reliability.
To ensure stability, it's essential to follow the recommended PCB layout, use a suitable output capacitor, and ensure that the input voltage is within the recommended range. Additionally, it's recommended to add a small ceramic capacitor (e.g., 10nF) between the EN pin and GND to prevent oscillation.
The TLV76733DGNR is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
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TLV76733DGNR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
