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TLV9041SIDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps 1.2-V ultra-low voltage, 350-kHz power saving single-channel op amp for battery powered systems 6-SOT-23 -40 to 125

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PCB Footprints
TLV9041SIDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
TLV9041SIDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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TLV9041SIDBVR Details

  • Manufacturer Part Number:

    TLV9041SIDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000012 µA

  • Bias Current-Max (IIB) @25C:

    0.000012 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    89 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2250 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.013 mA

  • Supply Voltage Limit-Max:

    3 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    223872.113

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV9041SIDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV9041SIDBVR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended compensation network, use a sufficient output capacitor, and ensure that the input and output impedance are matched. Additionally, it's recommended to use a low-ESR output capacitor and to minimize the loop area of the feedback network.
  • The maximum input voltage that can be applied to the TLV9041SIDBVR is 18V. Exceeding this voltage can cause damage to the device.
  • The TLV9041SIDBVR is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation and thermal resistance when operating in high-temperature environments. It's recommended to follow the thermal design guidelines provided in the datasheet.
  • The output voltage ripple of the TLV9041SIDBVR can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.

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TLV9041SIDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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