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TLV9061SQDBVRQ1 - Texas Instruments

Description: Operational Amplifiers - Op Amps AEC-Q100, 1-channel, 10-MHz, low-noise, RRIO, CMOS operational amplifier with shutdown capability 6-SOT-23 -40 to 125

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TLV9061SQDBVRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TLV9061SQDBVRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
TLV9061SQDBVRQ1 - Texas Instruments - 3D model - SOT23 (6-Pin) - DBV0006A
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TLV9061SQDBVRQ1 Details

  • Manufacturer Part Number:

    TLV9061SQDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-10-16

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    103 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    6.5 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    158489.3

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV9061SQDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for TLV9061SQDBVRQ1 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, ensure that the output capacitor is properly sized and placed close to the output pin. Also, use a low-ESR capacitor and avoid using a capacitor with high inductance. Additionally, ensure that the input and output traces are properly routed and decoupled.
  • The maximum power dissipation of TLV9061SQDBVRQ1 is dependent on the package thermal resistance and the ambient temperature. The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • Yes, TLV9061SQDBVRQ1 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • Use a voltage supervisor or a voltage monitor to detect overvoltage and undervoltage conditions. Add a voltage clamp or a TVS diode to protect the device from voltage transients. Ensure that the input voltage is within the recommended range and use a filter capacitor to reduce noise and ripple.

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TLV9061SQDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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