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TLV9352IDGKR - Texas Instruments

Description: Operational Amplifiers - Op Amps 40-V, dual-channel, 3.5-MHz, RRIO, MUX-friendly operational amplifier

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TLV9352IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9352IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV9352IDGKR Details

  • Manufacturer Part Number:

    TLV9352IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    21 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3 mm

TLV9352IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV9352IDGKR datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate power plane to minimize noise and ensure optimal performance.
  • The output capacitor selection depends on the output voltage, output current, and desired transient response. TI recommends using a low-ESR ceramic capacitor with a value between 10uF to 22uF for most applications. A higher capacitance value can be used for higher output currents or to improve transient response.
  • The TLV9352IDGKR has an absolute maximum input voltage rating of 18V. However, the recommended input voltage range is 4.5V to 15V for optimal performance and reliability.
  • The TLV9352IDGKR has an operating junction temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. TI recommends derating the output current and voltage at high temperatures to ensure reliable operation.
  • TI recommends following a systematic troubleshooting approach, including checking the PCB layout, component values, and soldering quality. Additionally, using an oscilloscope to measure the output voltage and current can help identify the root cause of the issue. TI also provides application notes and technical support resources to help troubleshoot and resolve issues.

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TLV9352IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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