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TLV9352IDR - Texas Instruments

Description: 40-V, dual 3.5MHz, RRO, MUX-friendly operational amplifier for cost-sensitive systems

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TLV9352IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV9352IDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLV9352IDR Details

  • Manufacturer Part Number:

    TLV9352IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2019-11-22

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -21 V

  • Neg Supply Voltage-Nom (Vsup):

    -20 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    21 V

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3.895 mm

TLV9352IDR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV9352IDR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The output capacitor should be chosen based on the desired output voltage ripple, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10uF to 22uF, and a voltage rating of at least 2x the output voltage. X5R or X7R ceramic capacitors are recommended for their low ESR and high reliability.
  • The TLV9352IDR can handle input voltages up to 18V, but it's recommended to keep the input voltage below 15V to ensure reliable operation and minimize the risk of damage.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a suitable output capacitor, and ensure that the input voltage is within the recommended range. Additionally, it's recommended to add a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins to filter out high-frequency noise.
  • The TLV9352IDR is rated for operation up to 125°C, but it's recommended to derate the output current and voltage at higher temperatures to ensure reliable operation. It's also essential to ensure good thermal design and heat dissipation to prevent overheating.

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TLV9352IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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