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TLV9362IDR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual, 40-V, 10-MHz operational amplifier

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TLV9362IDR - Texas Instruments - PCB symbol
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PCB Footprints
TLV9362IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-5
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3D Models
TLV9362IDR - Texas Instruments - 3D model - Small Outline Packages - SOIC-5
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TLV9362IDR Details

  • Manufacturer Part Number:

    TLV9362IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1700 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    25 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10600

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.895 mm

TLV9362IDR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TLV9362IDR datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, the TI website has a PCB layout guide that provides more detailed information on how to design a PCB for the TLV9362IDR.
  • The selection of input and output capacitors for the TLV9362IDR depends on the specific application requirements. Texas Instruments recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. The datasheet provides more information on capacitor selection and the TI website has a capacitor selection guide that can help with this process.
  • The TLV9362IDR has an operating ambient temperature range of -40°C to 125°C. However, the device can be operated at a higher temperature range with derating. The datasheet provides more information on the temperature derating curve.
  • To ensure the TLV9362IDR is stable and does not oscillate, it is recommended to follow the guidelines in the datasheet for component selection, PCB layout, and compensation. Additionally, the TI website has a stability analysis tool that can help with this process.
  • The TLV9362IDR has a maximum output current capability of 2A per channel. However, the actual output current capability may be limited by the thermal performance of the device and the PCB design. The datasheet provides more information on the output current capability and thermal performance.

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TLV9362IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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