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TLVM13660RDLR - Texas Instruments

Description: Switching Voltage Regulators 36-V input, 1-V to 6-V output, 6-A buck power module in 5-mm x 5.5-mm enhanced HotRod QFN 20-B3QFN -40 to 125

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PCB Footprints
TLVM13660RDLR - Texas Instruments PCB footprint - Other - Other - RDL0020A_2025
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TLVM13660RDLR - Texas Instruments  - 3D model - Other - RDL0020A_2025
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TLVM13660RDLR Details

  • Manufacturer Part Number:

    TLVM13660RDLR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    6 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC20,.2X.22(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    4.1 mm

  • Supply Current-Max (Isup):

    2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    HYBRID

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TLVM13660RDLR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range (-40°C to 125°C). Also, ensure the input voltage (VIN) is within the recommended range (2.7V to 5.5V).
  • A 1-10μF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. Place the capacitor as close to the VIN pin as possible.
  • Use a 10-22μF output capacitor (X5R or X7R dielectric) and ensure the output voltage is properly decoupled. Additionally, use a low-ESR capacitor and keep the output traces as short as possible.
  • Route the EN pin trace away from noisy signals and keep it as short as possible. Use a 1kΩ-10kΩ pull-up resistor to ensure the EN pin is properly biased.

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TLVM13660RDLR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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