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TMC223-LI - Analog Devices

Description: IC MTR DRVR BIPOLAR 3.3-5V 32QFN

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PCB Footprints
TMC223-LI - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 1-1623729-2
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3D Models
TMC223-LI - Analog Devices  - 3D model - Quad Flat No-Lead - 1-1623729-2
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TMC223-LI Details

  • Manufacturer Part Number:

    TMC223-LI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.27SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    29 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

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TMC223-LI Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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