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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for TMG25C60J
- Part Number TMG25C60J
- Manufacturer SanRex
- Pin Count 999
- Last Modified Date May 28, 2025 8:11 AM UTC
- Pinout / Pin List Click Here (Member Only)
TMG25C60J Details
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Manufacturer Part Number:
TMG25C60J
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Sanrex Corporation
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YTEOL:
6
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Critical Rate of Rise of Commutation Voltage-Min:
10 V/us
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DC Gate Trigger Current-Max:
30 mA
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DC Gate Trigger Voltage-Max:
1.5 V
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Leakage Current-Max:
5 mA
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Operating Temperature-Max:
125 °C
TMG25C60J Frequently Asked Questions (FAQs)
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A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the TMG25C60J, and to use thermal vias to dissipate heat to the top layer. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can also improve thermal performance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range specified in the datasheet. Additionally, consider using a heat sink with a high thermal conductivity, and ensure good thermal contact between the device and the heat sink. It's also crucial to follow proper PCB design and layout guidelines to minimize thermal resistance.
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The recommended soldering conditions for the TMG25C60J are: peak temperature of 260°C, soldering time of 10 seconds or less, and a temperature ramp-up rate of 3°C/s or less. It's also essential to use a solder with a high melting point and to follow the recommended soldering profile to prevent damage to the device.
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To handle ESD protection for the TMG25C60J, it's recommended to follow proper ESD handling procedures during assembly and storage. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD protection devices such as TVS diodes or ESD suppressors. Additionally, consider implementing ESD protection circuits in the PCB design to protect the device from electrostatic discharge.
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The recommended storage and handling conditions for the TMG25C60J are: storage temperature range of -40°C to 125°C, storage humidity of 60% or less, and handling with ESD-safe materials and equipment. It's also essential to avoid exposing the device to mechanical stress, vibration, or shock during storage and handling.
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TMG25C60J Overview
Use the download button to access the TMG25C60J 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
