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TMOV25SP230M - LITTELFUSE

Description: 360 V 20 kA Varistor 1 Circuit Through Hole Square 25mm, 3 Lead

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Symbol
TMOV25SP230M - LITTELFUSE - PCB symbol
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PCB Footprints
TMOV25SP230M - LITTELFUSE PCB footprint - Other - Other - TMOV25SP230M-2
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3D Models
TMOV25SP230M - LITTELFUSE - 3D model - Other - TMOV25SP230M-2
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TMOV25SP230M Details

  • Manufacturer Part Number:

    TMOV25SP230M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.40.00

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.75

  • Circuit RMS Voltage-Max:

    230 V

  • Energy Absorbing Capacity-Max:

    300 J

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    32.5 mm

  • Package Length:

    26.5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    Radial

  • Package Width:

    12.4 mm

  • Packing Method:

    BULK

  • Rated Temperature:

    85 °C

  • Reference Standard:

    CUL; TUV; UL

  • Resistor Type:

    VARISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL OXIDE

  • Terminal Finish:

    TIN

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    WIRE

  • Working Voltage:

    300 V

TMOV25SP230M Frequently Asked Questions (FAQs)

  • The recommended mounting method is to use a thermally conductive adhesive or thermal tape to attach the device to a heat sink or metal plate. This ensures good thermal conductivity and helps to dissipate heat efficiently.
  • While the TMOV25SP230M is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies, and additional testing may be required to ensure suitability.
  • The TMOV25SP230M is designed to respond quickly to overvoltage transients, with a response time of less than 1 μs. It can absorb high-energy surges and limit the voltage across the device to a safe level, protecting downstream components from damage.
  • Yes, the TMOV25SP230M is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C. However, it's essential to follow the recommended soldering profile to ensure reliable assembly.
  • The typical thermal resistance of the TMOV25SP230M is around 10°C/W, which means that for every watt of power dissipated, the device's temperature will rise by 10°C above the ambient temperature.

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TMOV25SP230M Overview

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