Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TMP8279P-5 - Toshiba

Description: Programmable Keyboard/Display Interface

Download TMP8279P-5 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TMP8279P-5 - Toshiba - PCB symbol
click to zoom
PCB Footprints
TMP8279P-5 - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP40-P-600
click to zoom
3D Models
TMP8279P-5 - Toshiba - 3D model - Dual-In-Line Packages - DIP40-P-600
click to zoom

TMP8279P-5 Details

  • Manufacturer Part Number:

    TMP8279P-5

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, PLASTIC, DIP-40

  • Pin Count:

    40

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e0

  • Length:

    50.7 mm

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Supply Current-Max:

    120 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

TMP8279P-5 Frequently Asked Questions (FAQs)

  • Toshiba recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Toshiba recommends following the derating guidelines in the datasheet, ensuring proper thermal design, and using a heat sink if necessary. Additionally, consider using a thermistor or thermal monitoring IC to monitor the temperature.
  • Although the datasheet specifies a maximum VCC of 5.5V, Toshiba recommends not exceeding 5V to ensure reliable operation and minimize the risk of damage.
  • Yes, the TMP8279P-5 has a low quiescent current of 1.5mA, making it suitable for battery-powered devices. However, consider using a power-down mode or a low-power mode to minimize power consumption.
  • Toshiba recommends following proper ESD handling procedures during assembly and storage. Additionally, consider using ESD protection devices, such as TVS diodes, on the input pins to protect against electrostatic discharge.

Trust Checks

This model has been verified by system checks.
System Verified
Sponsored

TMP8279P-5 Overview

Use the download button to access the TMP8279P-5 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TMP82, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

Parts related to TMP8279P-5

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

TMP8279P-5 Alternates

Showing results

Image Part Number Model
Part Image QD8279-5 Intel Corporation

QD8279-5
Part Image AM8279-5PC AMD

AM8279-5PC
Part Image AM8279-5CCB AMD

Microprocessor Circuit, MOS, CDIP40
Part Image AM8279-5PCB AMD

Microprocessor Circuit, MOS, PDIP40
Part Image AM8279-5DCTB AMD

Microprocessor Circuit, MOS, CDIP40
For a full list of alternate parts for TMP8279P-5, check out Findchips.com