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- Part Number TMPM366FDXBG
- Manufacturer Toshiba
- Pin Count 109
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - P-TFBGA109-0909-0.65-002
- Released Date Aug 11, 2021
- Last Modified Date Dec 2, 2023 6:27 AM UTC
- Pinout / Pin List Click Here (Member Only)
TMPM366FDXBG Details
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Manufacturer Part Number:
TMPM366FDXBG
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Rohs Code:
Yes
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Part Life Cycle Code:
Not Recommended
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HTS Code:
8542.31.00.25
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Factory Lead Time:
43 Weeks
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Manufacturer:
Toshiba America Electronic Components
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YTEOL:
3
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Has ADC:
YES
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Bit Size:
32
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CPU Family:
CORTEX-M3
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DAC Channels:
NO
TMPM366FDXBG Frequently Asked Questions (FAQs)
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Toshiba recommends a 4-layer PCB with a thermal via array under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB.
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Implement thermal management measures such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
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The POR circuit should be designed to ensure that the device is held in reset for at least 10ms after power-on. The BOR circuit should be designed to detect voltage drops below 2.5V and hold the device in reset for at least 10ms after the voltage returns to a safe level.
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Use the device's power-saving modes, such as sleep mode and standby mode, to reduce power consumption. Also, optimize the system's clock frequency and voltage to minimize power consumption. Additionally, consider using a low-power oscillator and disabling unused peripherals.
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Implement ESD protection measures such as TVS diodes, ESD protection ICs, and PCB design guidelines to prevent damage from electrostatic discharge. Ensure that the device is handled and stored in an ESD-safe environment.
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TMPM366FDXBG Overview
Use the download button to access the TMPM366FDXBG schematic symbol, PCB footprint, and 3D model.
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