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TMPM368FDFG - Toshiba

Description: package-lqfp100

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TMPM368FDFG - Toshiba PCB footprint - Quad Flat Packages - Quad Flat Packages - lqfp100*
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TMPM368FDFG - Toshiba  - 3D model - Quad Flat Packages - lqfp100*
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TMPM368FDFG Details

  • Manufacturer Part Number:

    TMPM368FDFG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-100

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    43 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M3

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    64

  • Number of External Interrupts:

    10

  • Number of I/O Lines:

    60

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    100

  • Number of Timers:

    12

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    131072

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    88 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TMPM368FDFG Frequently Asked Questions (FAQs)

  • Toshiba recommends a 4-layer PCB with a thermal via array under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB.
  • Implement thermal management measures such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
  • Power sequencing should be done in the following order: VCC, VDD, AVCC, and DVCC. Voltage ramp-up should be done slowly (typically 1-2 ms) to prevent latch-up and ensure reliable operation.
  • Implement ESD protection measures such as TVS diodes, ESD diodes, or ESD arrays on the PCB. Ensure that the device is handled and stored in an ESD-safe environment.
  • Toshiba recommends using 0.1 μF to 1 μF ceramic capacitors for decoupling, placed as close as possible to the power pins. Additional bulk capacitors (e.g., 10 μF) can be used for further noise reduction.

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TMPM368FDFG Overview

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