Toshiba recommends a 4-layer PCB with a thermal via array under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB.
Implement thermal management measures such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
Power sequencing should be done in the following order: VCC, VDD, AVCC, and DVCC. Voltage ramp-up should be done slowly (typically 1-2 ms) to prevent latch-up and ensure reliable operation.
Implement ESD protection measures such as TVS diodes, ESD diodes, or ESD arrays on the PCB. Ensure that the device is handled and stored in an ESD-safe environment.
Toshiba recommends using 0.1 μF to 1 μF ceramic capacitors for decoupling, placed as close as possible to the power pins. Additional bulk capacitors (e.g., 10 μF) can be used for further noise reduction.
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