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TMPM373FWDUG - Toshiba

Description: Toshiba

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PCB Footprints
TMPM373FWDUG - Toshiba PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP48-P-0707-0.50C
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TMPM373FWDUG - Toshiba  - 3D model - Quad Flat Packages - LQFP48-P-0707-0.50C
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TMPM373FWDUG Details

  • Manufacturer Part Number:

    TMPM373FWDUG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M3

  • Clock Frequency-Max:

    10 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Number of External Interrupts:

    8

  • Number of I/O Lines:

    37

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    48

  • Number of Timers:

    1

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    6144

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    80 MHz

  • Supply Current-Max:

    59.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TMPM373FWDUG Frequently Asked Questions (FAQs)

  • Toshiba recommends a 4-layer PCB with a thermal via array under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB.
  • Implement thermal management measures such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
  • Power sequencing should be done in the following order: VCC, VDD, and AVCC. The supply voltage should be ramped up slowly (typically 1-10 ms) to prevent latch-up and ensure proper device operation.
  • The POR and BOR functions are enabled by default. The POR function resets the device when the supply voltage rises above the POR threshold (typically 1.5 V). The BOR function resets the device when the supply voltage falls below the BOR threshold (typically 1.2 V).
  • Follow standard EMC/EMI design practices, such as using a solid ground plane, decoupling capacitors, and shielding. Ensure that the device is placed at least 1 mm away from the PCB edge to reduce radiation.

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TMPM373FWDUG Overview

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