Toshiba recommends a 4-layer PCB with a thermal via array under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB.
Implement thermal management measures such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
Power sequencing should be done in the following order: VCC, VDD, and AVCC. The supply voltage should be ramped up slowly (typically 1-10 ms) to prevent latch-up and ensure proper device operation.
The POR and BOR functions are enabled by default. The POR function resets the device when the supply voltage rises above the POR threshold (typically 1.5 V). The BOR function resets the device when the supply voltage falls below the BOR threshold (typically 1.2 V).
Follow standard EMC/EMI design practices, such as using a solid ground plane, decoupling capacitors, and shielding. Ensure that the device is placed at least 1 mm away from the PCB edge to reduce radiation.
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