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TMS320C6202GJL250 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc

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TMS320C6202GJL250 - Texas Instruments PCB footprint - BGA - BGA - GJL (S-PBGA-N352)_2021
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3D Models
TMS320C6202GJL250 - Texas Instruments  - 3D model - BGA - GJL (S-PBGA-N352)_2021
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TMS320C6202GJL250 Details

  • Manufacturer Part Number:

    TMS320C6202GJL250

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-352

  • Pin Count:

    352

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    250 MHz

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B352

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    352

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA352,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    32768

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    3.8 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6202GJL250 Frequently Asked Questions (FAQs)

  • The recommended clock frequency for optimal performance is 250 MHz, but it can operate up to 300 MHz with reduced voltage and temperature ranges.
  • The TMS320C6202GJL250 has a DDR interface, but it requires specific timing and signal integrity considerations. Refer to the TI application note 'DDR Interfacing to TMS320C62x/C64x/C67x Devices' for implementation details.
  • The TMS320C6202GJL250 can interface up to 256 MB of external memory, but this is limited by the 16-bit address bus and the memory interface timing.
  • To optimize power consumption, use the low-power modes (Idle, Standby, and Shutdown), reduce clock frequency, and minimize external memory accesses. Also, use the Power Management Module (PMM) to control voltage and frequency scaling.
  • The recommended approach is to use a boot loader that resides in the on-chip ROM, which can load the application code from external memory or other sources. TI provides a ROM-based boot loader example in the C6000 Code Generation Tools.

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TMS320C6202GJL250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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