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TMS320C6711DGDP250 - Texas Instruments

Description: Texas Instruments TMS320C6711DGDP250, 32bit Digital Signal Processor 250MHz 72 kB EPROM 272-Pin BGA

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PCB Footprints
TMS320C6711DGDP250 - Texas Instruments PCB footprint - BGA - BGA - GDP (S–PBGA–N272)
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3D Models
TMS320C6711DGDP250 - Texas Instruments  - 3D model - BGA - GDP (S–PBGA–N272)
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TMS320C6711DGDP250 Details

  • Manufacturer Part Number:

    TMS320C6711DGDP250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    272

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    250 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B272

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of Terminals:

    272

  • Number of Timers:

    2

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA272,20X20,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.57 mm

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.33 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6711DGDP250 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the TMS320C6711DGDP250 is -40°C to 100°C.
  • The EMIF can be configured using the EMIF Configuration Registers (ECR) and the External Memory Interface Control Registers (EMCR). Refer to the TMS320C6711 DSP Peripheral Component Interconnect (PCI) and External Memory Interface (EMIF) User's Guide for more information.
  • The maximum clock frequency supported by the TMS320C6711DGDP250 is 225 MHz.
  • A boot loader can be implemented using the ROM boot loader or a custom boot loader. The ROM boot loader can be configured using the Boot Mode Select (BMS) pins. For a custom boot loader, refer to the TMS320C6711 DSP Boot Loader User's Guide for more information.
  • The power consumption of the TMS320C6711DGDP250 varies depending on the operating frequency and voltage. At 225 MHz and 1.8V, the typical power consumption is around 1.2W. Refer to the TMS320C6711 DSP Power Consumption User's Guide for more information.

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TMS320C6711DGDP250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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