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TMS320C6713BZDP300 - Texas Instruments

Description: Floating-Point Digital Signal Processors

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TMS320C6713BZDP300 - Texas Instruments PCB footprint - BGA - BGA - ZDP (S–PBGA–N272)
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TMS320C6713BZDP300 - Texas Instruments  - 3D model - BGA - ZDP (S–PBGA–N272)
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TMS320C6713BZDP300 Details

  • Manufacturer Part Number:

    TMS320C6713BZDP300

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    272

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    300 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B272

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of Terminals:

    272

  • Number of Timers:

    2

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA272,20X20,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    65536

  • Seated Height-Max:

    2.57 mm

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.33 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6713BZDP300 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the TMS320C6713BZDP300 is 300 MHz.
  • The TMS320C6713BZDP300 has 256 KB of on-chip memory, divided into 64 KB of data RAM and 192 KB of program RAM.
  • The power consumption of the TMS320C6713BZDP300 varies depending on the operating frequency and voltage. At 300 MHz and 1.2V, the typical power consumption is around 1.2W.
  • Yes, the TMS320C6713BZDP300 has a built-in floating-point unit (FPU) that supports single-precision floating-point operations.
  • The maximum external memory bandwidth of the TMS320C6713BZDP300 is 32 bits at 100 MHz, which translates to a maximum bandwidth of 800 MB/s.

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TMS320C6713BZDP300 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TMS320C6713BGDP300 Texas Instruments

Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 300MHz, CMOS, PBGA272