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TMS320C6727BGDH350 - Texas Instruments

Description: Floating-Point Digital Signal Processor

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TMS320C6727BGDH350 - Texas Instruments PCB footprint - BGA - BGA - GDH(S-PBGA-N256)
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TMS320C6727BGDH350 Details

  • Manufacturer Part Number:

    TMS320C6727BGDH350

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of Terminals:

    256

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    262144

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    2.02 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6727BGDH350 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., CAS latency, RAS-to-CAS delay) are set according to the memory device's datasheet. Additionally, adjust the EMIF clock frequency and phase to match the memory device's requirements.
  • The maximum clock frequency supported by the TMS320C6727BGDH350 is 350 MHz. However, the actual clock frequency may be limited by the specific application, PCB design, and environmental conditions.
  • To implement a reliable boot process, ensure that the boot mode is correctly configured (e.g., via the BOOTMODE pins), and that the boot loader is properly programmed into the flash memory. Additionally, implement a robust reset and clocking scheme to ensure a reliable boot process.
  • To ensure reliable operation, it is essential to manage the thermal performance of the TMS320C6727BGDH350. This includes providing adequate heat sinking, ensuring good airflow, and monitoring the device's temperature using the on-chip temperature sensor.

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TMS320C6727BGDH350 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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