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TMS320C6727BZDH275 - Texas Instruments

Description: Texas Instruments TMS320C6727BZDH275, 32 bit, 64 bit Digital Signal Processor 275MHz 32 kB Flash 256-Pin BGA

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TMS320C6727BZDH275 - Texas Instruments PCB footprint - BGA - BGA - ZDH(S-PBGA-N256)_2021
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TMS320C6727BZDH275 - Texas Instruments  - 3D model - BGA - ZDH(S-PBGA-N256)_2021
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TMS320C6727BZDH275 Details

  • Manufacturer Part Number:

    TMS320C6727BZDH275

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of Terminals:

    256

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    262144

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    2.02 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6727BZDH275 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply power to the core voltage (VDD) first, followed by the input/output voltage (VDDIO). This ensures that the internal voltage regulators are powered up correctly.
  • To configure the EMIF for optimal performance, ensure that the memory clock frequency is set correctly, and the memory timing parameters (e.g. CAS latency, RAS-to-CAS delay) are configured according to the memory device specifications. Additionally, use the EMIF configuration registers to optimize the memory access timing and burst length.
  • The maximum operating temperature range for the TMS320C6727BZDH275 is -40°C to 85°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.
  • The TMS320C6727BZDH275 has a built-in watchdog timer module that can be configured to generate a reset signal if the device fails to respond within a specified time period. To implement a watchdog timer, configure the watchdog timer module registers to set the timeout period, and ensure that the watchdog timer is periodically reset by the application software.
  • The maximum clock frequency supported by the TMS320C6727BZDH275 is 350 MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal.

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TMS320C6727BZDH275 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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