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TMS320DM355DZCE135 - Texas Instruments

Description: Digital Media System-on-Chip

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TMS320DM355DZCE135 - Texas Instruments - PCB symbol
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PCB Footprints
TMS320DM355DZCE135 - Texas Instruments PCB footprint - Other - Other - BGA337C65P19X19_1300X1300X130
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3D Models
TMS320DM355DZCE135 - Texas Instruments - 3D model - Other - BGA337C65P19X19_1300X1300X130
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TMS320DM355DZCE135 Details

  • Manufacturer Part Number:

    TMS320DM355DZCE135

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    NFBGA-337

  • Pin Count:

    337

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

  • Bit Size:

    32

  • Bus Compatibility:

    I2C; SPI; UART; USB

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • JESD-30 Code:

    S-PBGA-B337

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    337

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA337,19X19,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    8192

  • Seated Height-Max:

    1.3 mm

  • Supply Voltage-Max:

    1.365 V

  • Supply Voltage-Min:

    1.235 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    Digital Media SoC

TMS320DM355DZCE135 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply power to the DVDD and CVDD pins first, followed by the clock signal, and then the reset signal. This ensures proper initialization of the device.
  • To optimize power consumption, use the device's power management features such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, use low-power modes such as idle and standby modes when the device is not actively processing data.
  • The maximum clock frequency for the DM355's ARM core is 270 MHz. However, the actual clock frequency may be limited by the specific application and the device's power consumption requirements.
  • The DM355 has a dedicated video processing unit (VPU) that can be used to accelerate video processing tasks. The VPU can be programmed using the TI-provided video processing software development kit (SDK). Additionally, the device's ARM core can be used to perform video processing tasks using software libraries such as the TI-provided video codec engine.
  • The DM355 has a 16-bit external memory interface that can be used to connect up to 128 MB of external memory. However, the actual amount of external memory that can be used may be limited by the specific application and the device's memory bandwidth requirements.

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TMS320DM355DZCE135 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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