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TMS320DM368ZCEDF - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on- Chip

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PCB Footprints
TMS320DM368ZCEDF - Texas Instruments PCB footprint - BGA - BGA - ZCE (S-PBGA-N338)_2021
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3D Models
TMS320DM368ZCEDF - Texas Instruments  - 3D model - BGA - ZCE (S-PBGA-N338)_2021
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TMS320DM368ZCEDF Details

  • Manufacturer Part Number:

    TMS320DM368ZCEDF

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    338

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bit Size:

    32

  • Bus Compatibility:

    I2C; SPI; UART; USB

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • JESD-30 Code:

    S-PBGA-B338

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    338

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA338,19X19,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    8192

  • Seated Height-Max:

    1.3 mm

  • Supply Voltage-Max:

    1.42 V

  • Supply Voltage-Min:

    1.28 V

  • Supply Voltage-Nom:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    Digital Media SoC

TMS320DM368ZCEDF Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply power to the DVDD, then the CVDD, and finally the AVDD. This sequence helps prevent latch-up and ensures proper device operation.
  • The DM368 has multiple clock domains that need to be configured correctly. The ARM subsystem clock, DDR clock, and peripheral clocks need to be configured using the clock control registers. Refer to the TRM (Technical Reference Manual) for detailed information on clock domain configuration.
  • The maximum frequency of the DDR interface on the DM368 is 400 MHz. However, the actual frequency depends on the DDR memory module used and the system design.
  • To optimize power consumption, use the power management registers to control the clock domains, disable unused peripherals, and adjust the voltage and frequency of the CPU and DDR. Additionally, use the low-power modes (e.g., idle, standby) when the device is not actively processing data.
  • The EMIF is used to interface with external memory devices such as DDR, NAND, and NOR flash. It provides a flexible interface for connecting various types of memory devices to the DM368.

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TMS320DM368ZCEDF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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