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TMS320LC548PGE-66 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc

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TMS320LC548PGE-66 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
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TMS320LC548PGE-66 - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
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TMS320LC548PGE-66 Details

  • Manufacturer Part Number:

    TMS320LC548PGE-66

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    144

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Date Of Intro:

    1988-11-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    23

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    20 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    5

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    144

  • Number of Timers:

    1

  • On Chip Data RAM Width:

    16

  • On Chip Program ROM Width:

    16

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    8000

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320LC548PGE-66 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide for the TMS320LC548PGE-66 in the 'TMS320LC54x PowerPAD Thermally Enhanced Package' application report (SLUA139). It's essential to follow this guide to ensure proper thermal management and signal integrity.
  • Optimizing the clock tree involves using the clock domain crossing (CDC) feature, configuring the clock generator module, and using the clock frequency planning tool (CFPT) provided by Texas Instruments. Refer to the 'TMS320LC54x Clock Frequency Planning Tool User's Guide' (SPRU514) for more information.
  • The TMS320LC548PGE-66 has an operating temperature range of -40°C to 85°C. However, it's essential to consider the thermal design and heat dissipation to ensure the device operates within the recommended temperature range.
  • The TMS320LC548PGE-66 has a power management module that allows for dynamic voltage and frequency scaling. Implement power management by configuring the power management registers, using the low-power modes, and optimizing the clock frequency and voltage scaling.
  • To minimize EMI and ensure EMC, follow the guidelines in the 'TMS320LC54x Electromagnetic Compatibility (EMC) and Electromagnetic Interference (EMI) Design Guide' (SLAA344). This includes using proper shielding, grounding, and layout techniques, as well as selecting components with low EMI susceptibility.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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