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TMS320VC549GGU-100 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Dig Sig Proc

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PCB Footprints
TMS320VC549GGU-100 - Texas Instruments PCB footprint - BGA - BGA - GGU (S-PBGA-N144)
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3D Models
TMS320VC549GGU-100 - Texas Instruments  - 3D model - BGA - GGU (S-PBGA-N144)
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TMS320VC549GGU-100 Details

  • Manufacturer Part Number:

    TMS320VC549GGU-100

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-144

  • Pin Count:

    144

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    23

  • Barrel Shifter:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    20 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e0

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA144,13X13,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    32768

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320VC549GGU-100 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the TMS320VC549GGU-100 datasheet and application notes. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • The TMS320VC549GGU-100 has various power-saving features, such as dynamic voltage and frequency scaling, idle modes, and clock gating. Engineers can optimize power consumption by using these features, selecting the appropriate clock frequency, and optimizing their software implementation.
  • To minimize EMI and ensure EMC, engineers should follow proper PCB layout and design practices, such as using shielding, grounding, and decoupling capacitors. They should also consider using EMI filters and ferrite beads in their design.
  • Engineers should implement a robust boot loader and firmware update mechanism, using features such as boot mode selection, secure boot, and error correction mechanisms. They should also ensure that the boot loader and firmware are properly validated and tested.
  • Engineers should carefully review the datasheet and application notes to understand the limitations and constraints of each peripheral, such as clock frequency, data transfer rates, and pin multiplexing. They should also consider using peripheral-specific libraries and drivers to simplify their design.

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TMS320VC549GGU-100 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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