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TMS320VC5509PGE31 - Texas Instruments

Description: IC DSP FIX PT 16-BIT 144-LQFP

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TMS320VC5509PGE31 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
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TMS320VC5509PGE31 - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
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TMS320VC5509PGE31 Details

  • Manufacturer Part Number:

    TMS320VC5509PGE31

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, LQFP-144

  • Pin Count:

    144

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    14

  • Barrel Shifter:

    NO

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (words):

    131072

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.68 V

  • Supply Voltage-Min:

    1.52 V

  • Supply Voltage-Nom:

    1.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS320VC5509PGE31 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V to 1.4V) first, followed by VIO (1.8V to 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • Optimization involves selecting the right clock frequency, configuring the cache and memory interfaces, and using the right compiler optimization flags. Consult the TMS320VC5509PGE31's technical reference manual and the TI's Code Composer Studio (CCS) documentation for guidance.
  • The TMS320VC5509PGE31 has a thermal design power (TDP) of 1.2W. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a PCB design that allows for good airflow. Consult the thermal design guide from TI for more information.
  • The TMS320VC5509PGE31 has several low-power modes, including idle, standby, and shutdown. Use the Power Manager (PM) module to control these modes. Consult the technical reference manual for register settings and programming details.
  • Follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering components. Consult the TI's EMI/EMC guidelines and the IEC 61967 standard for more information.

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TMS320VC5509PGE31 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TMS320VC5509APGE11 Texas Instruments

Digital Signal Processor, 32-Bit Size, 16-Ext Bit, 50MHz, CMOS, PQFP144