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TMS32C6414EGLZ7E3 - Texas Instruments

Description: Fixed-Point Digital Signal Processor

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TMS32C6414EGLZ7E3 - Texas Instruments PCB footprint - BGA - BGA - GLZ(S-PBGA-N532)
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TMS32C6414EGLZ7E3 - Texas Instruments  - 3D model - BGA - GLZ(S-PBGA-N532)
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TMS32C6414EGLZ7E3 Details

  • Manufacturer Part Number:

    TMS32C6414EGLZ7E3

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    FCBGA-532

  • Pin Count:

    532

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3VI/O SUPPLY

  • Address Bus Width:

    20

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    75.75 MHz

  • External Data Bus Width:

    64

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B532

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of DMA Channels:

    64

  • Number of External Interrupts:

    4

  • Number of Terminals:

    532

  • Number of Timers:

    3

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HFBGA

  • Package Equivalence Code:

    BGA532,26X26,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    16384

  • Seated Height-Max:

    3.25 mm

  • Supply Current-Max:

    125 mA

  • Supply Voltage-Max:

    1.44 V

  • Supply Voltage-Min:

    1.36 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS32C6414EGLZ7E3 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V to 1.4V) first, followed by VIO (1.8V to 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., clock frequency, latency, and burst length) are set according to the memory device specifications. Additionally, use the EMIF configuration registers to adjust the memory interface settings, such as the data strobe timing and the memory type.
  • The maximum operating frequency of the TMS320C6414EGLZ7E3 is 720 MHz. However, the actual operating frequency may be limited by the specific application, system design, and thermal considerations.
  • The TMS320C6414EGLZ7E3 has a built-in watchdog timer module. To implement a watchdog timer, configure the watchdog timer registers to set the timer period, enable the timer, and define the reset behavior. The watchdog timer can be used to detect and recover from system faults or hangs.
  • The TCK pin is used for boundary scan testing and debugging. It is connected to the JTAG (Joint Test Action Group) interface, which allows for testing and debugging of the device using specialized tools and software.

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TMS32C6414EGLZ7E3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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