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TMS32C6713BZDPA200 - Texas Instruments

Description: Floating-Point Digital Signal Processors

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TMS32C6713BZDPA200 - Texas Instruments PCB footprint - BGA - BGA - ZDP (S–PBGA–N272)
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TMS32C6713BZDPA200 - Texas Instruments  - 3D model - BGA - ZDP (S–PBGA–N272)
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TMS32C6713BZDPA200 Details

  • Manufacturer Part Number:

    TMS32C6713BZDPA200

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    272

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    200 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B272

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of Terminals:

    272

  • Number of Timers:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA272,20X20,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    65536

  • Seated Height-Max:

    2.57 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMS32C6713BZDPA200 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the TMS320C6713BZDPA200 is -40°C to 100°C.
  • The EMIF can be configured using the EMIF registers, which are described in the TMS320C6713BZDPA200 datasheet. Additionally, Texas Instruments provides a detailed application report (SPRA969) that provides guidelines for configuring the EMIF.
  • The maximum clock frequency for the TMS320C6713BZDPA200 is 225 MHz.
  • Texas Instruments provides a boot loader example code in the TMS320C6713BZDPA200 software development kit (SDK). The boot loader can be implemented using the ROM boot loader or the Flash boot loader, depending on the application requirements.
  • The power consumption of the TMS320C6713BZDPA200 varies depending on the operating frequency, voltage, and application. The typical power consumption is around 1.2W at 225 MHz, but it can be optimized using power management techniques.

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TMS32C6713BZDPA200 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TMS32C6713BGDPA200 Texas Instruments

Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 200MHz, CMOS, PBGA272