TMS5702135DZWTQQ1 - Texas Instruments

TMS5702135DZWTQQ1 Details

• Manufacturer Part Number:

  TMS5702135DZWTQQ1

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  NFBGA-337

• Country Of Origin:

  Philippines

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.75

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Has ADC:

  YES

• Address Bus Width:

  22

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-R4

• Clock Frequency-Max:

  80 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  16

• Format:

  FLOATING POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B337

• JESD-609 Code:

  e1

• Length:

  16 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  16

• Number of I/O Lines:

  144

• Number of Serial I/Os:

  7

• Number of Terminals:

  337

• Number of Timers:

  45

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  262144

• ROM (words):

  2097152

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.4 mm

• Speed:

  180 MHz

• Supply Current-Max:

  700 mA

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  16 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC