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TMS5703137CGWTQEP - Texas Instruments

Description: Enhanced Product 16/32 Bit RISC Flash Arm Cortex-R4F, EMAC, FlexRay

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TMS5703137CGWTQEP - Texas Instruments PCB footprint - BGA - BGA - GWT (S-PBGA-N337)--
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TMS5703137CGWTQEP - Texas Instruments  - 3D model - BGA - GWT (S-PBGA-N337)--
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TMS5703137CGWTQEP Details

  • Manufacturer Part Number:

    TMS5703137CGWTQEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    337

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 3.3 V I/O SUPPLY

  • Address Bus Width:

    22

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-R4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B337

  • JESD-609 Code:

    e0

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    144

  • Number of Serial I/Os:

    11

  • Number of Terminals:

    337

  • Number of Timers:

    51

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA337,19X19,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • RAM (bytes):

    262144

  • RAM (words):

    256

  • ROM (words):

    3145728

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    180 MHz

  • Supply Current-Max:

    440 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TMS5703137CGWTQEP Frequently Asked Questions (FAQs)

  • The TMS5703137CGWTQEP can operate from -40°C to 125°C (junction temperature).
  • The clock system can be configured using the Clock Manager (CLKMAN) module. Refer to the device's user guide for detailed configuration steps.
  • The CPU can operate up to 200 MHz, while peripherals can operate up to 100 MHz.
  • The TMS5703137CGWTQEP has built-in safety features such as ECC, parity, and CRC. Refer to the device's safety manual for implementation details.
  • A simple POR circuit can be implemented using a resistor, capacitor, and diode. Refer to the device's datasheet for a recommended circuit diagram.

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TMS5703137CGWTQEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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