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TMSC6701GJC16719V - Texas Instruments

Description: Floating-Point Digital Signal Processor

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TMSC6701GJC16719V - Texas Instruments PCB footprint - BGA - BGA - GJC (S-PBGA-N352)
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TMSC6701GJC16719V - Texas Instruments  - 3D model - BGA - GJC (S-PBGA-N352)
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TMSC6701GJC16719V Details

  • Manufacturer Part Number:

    TMSC6701GJC16719V

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    352

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Date Of Intro:

    1999-02-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    166.67 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B352

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    4

  • Number of Terminals:

    352

  • Number of Timers:

    2

  • Operating Temperature-Max:

    90 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA352,26X26,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    16384

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.99 V

  • Supply Voltage-Min:

    1.81 V

  • Supply Voltage-Nom:

    1.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    35 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMSC6701GJC16719V Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation.
  • Ensure that the device is properly decoupled, and that the power supply is stable and well-regulated. Also, follow the recommended operating conditions and thermal management guidelines.
  • Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. It's recommended to operate the device at a temperature at least 10°C below the maximum rating to ensure optimal performance and reliability.
  • Check the power supply voltage, ensure that the POR and BOR thresholds are set correctly, and verify that the reset and brown-out detection circuits are functioning correctly.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Ensure that the device is placed in a shielded enclosure, and that all cables and connectors are properly shielded and filtered.

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TMSC6701GJC16719V Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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