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TMSDC6727BZDHA250 - Texas Instruments

Description: Floating-Point Digital Signal Processor

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PCB Footprints
TMSDC6727BZDHA250 - Texas Instruments PCB footprint - BGA - BGA - ZDH(S-PBGA-N256)_2021
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3D Models
TMSDC6727BZDHA250 - Texas Instruments  - 3D model - BGA - ZDH(S-PBGA-N256)_2021
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TMSDC6727BZDHA250 Details

  • Manufacturer Part Number:

    TMSDC6727BZDHA250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    25 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of Terminals:

    256

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    262144

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    2.02 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

TMSDC6727BZDHA250 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use controlled impedance traces, add series termination resistors, and use a common clock and data signal routing strategy to minimize skew and ensure signal integrity.
  • Power up the device in the following sequence: VDD, VDDA, VDDC, and finally VREF. This ensures that the internal voltage regulators are powered up correctly.
  • Use the Power-Down (PD) pin to control the device's power-down modes. Asserting the PD pin will put the device into a low-power state, and de-asserting it will return the device to its normal operating state.
  • Use 0.1uF and 10uF decoupling capacitors placed close to the device's power pins to filter out noise and ensure stable operation.

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TMSDC6727BZDHA250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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